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	1.	Electronic Packaging materials and thier properties / Michael Pecht...[et al.]. by Pecht, Michael G Material type: Text; Format: print Publication details: New York : Springer, 1999 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7870.15 . E4222. Place hold Add to cart (remove)
	2.	Guidebook for managing silicon chip reliability / Michael G. Pecht, Riko Radojcic, Riko Radojcic, Gopal Rao. by Pecht, Michael G Radojcic, Riko Rao, Gopal Material type: Text; Format: print Publication details: New York : CRC Press, 1999 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7874 . P425. Place hold Add to cart (remove)
	3.	Influence of temperature on microelectronics and system reliability / Pradeep Lall, Michael G. Pecht, Edward B. Hakim. by Lall, Pradeep Pecht, Michael G Hakim, Edward B Series: The electronic packaging series Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton, Flu : CRC Press, 1997 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.25 . L35. Place hold Add to cart (remove)

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