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	1.	Chip on board technologies for multichip modules / edited by John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : VNR, 1994 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . C55. Place hold Add to cart (remove)
	2.	Handbook of fine pitch surface munt technology / edited by John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : VNR, 1994 Availability: Items available for loan: MAIN LIBRARY (2)Location, call number: Main Library TK7780.15 . H364, ... Place hold Add to cart (remove)
	3.	No cover image available Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang. by Hwang, Jennis Material type: Text; Format: print Publication details: New York : VNR, 1989 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7868 . P7482. Place hold Add to cart (remove)

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