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	1.	Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief by Harper, Charles A Series: Electronic packaging and interconnection series \| McGraw-Hill handbooks Edition: 3rd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, 2000 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . E42 2000. Place hold Add to cart (remove)
	2.	Electronic packaging and interconnection handbook / Charles A. Harper by Harper, Charles A Edition: 4th ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, 2005 Availability: Items available for loan: MAIN LIBRARY (2)Location, call number: Main Library Reference Collection TK7870.15 . E42 2005, ... Place hold Add to cart (remove)
	3.	No cover image available Electronic packaging, microelectronics, and interconnection dictionary / Charles A. Harper, martin B. Miller. by Harper, Charles A Miller, Martin B. (Martin Boniface) Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: New York : McGraw Hill, 1993 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7804 . H34. Place hold Add to cart (remove)
	4.	Chip on board technologies for multichip modules / edited by John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : VNR, 1994 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . C55. Place hold Add to cart (remove)
	5.	Electronic equipment packaging technology / Gerald Ginsberg. by Ginsberg, Gerald Material type: Text; Format: print Publication details: New York : Van Nostrand Reinhold, 1991 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . G56. Place hold Add to cart (remove)
	6.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S Avtgis, Alexander W Megow, William F Edition: 5th ed. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Publication details: Englewood Cliffs, New Jersey : Prentice Hall, 1996 Availability: Items available for loan: MAIN LIBRARY (8)Location, call number: Main Library TK7836 . V55 1996, ... Place hold Add to cart (remove)
	7.	Multichip modules & related technologies / Donald P. Schnorr by Ginsberg, Gerald L Schnorr, Donald P Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: New York : McGraw-Hill, Inc, 1994 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7870.15 . G563. Place hold Add to cart (remove)
	8.	Electronic Packaging materials and thier properties / Michael Pecht...[et al.]. by Pecht, Michael G Material type: Text; Format: print Publication details: New York : Springer, 1999 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7870.15 . E4222. Place hold Add to cart (remove)
	9.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S Avtgis, Alexander W Megow, William F Edition: 6th ed. Material type: Text; Format: print Publication details: New Jersey : Prentice-Hall, 1999 Availability: Items available for loan: MAIN LIBRARY (2)Location, call number: Main Library TK7836 . V55 1999, ... Place hold Add to cart (remove)
	10.	High-frequency characterization of electronic packaging / Luc Martens. by Martens, Luc Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boston : Kluwer Academic, 1998 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . M37. Place hold Add to cart (remove)
	11.	Guidebook for managing silicon chip reliability / Michael G. Pecht, Riko Radojcic, Riko Radojcic, Gopal Rao. by Pecht, Michael G Radojcic, Riko Rao, Gopal Material type: Text; Format: print Publication details: New York : CRC Press, 1999 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library TK7874 . P425. Place hold Add to cart (remove)
	12.	Influence of temperature on microelectronics and system reliability / Pradeep Lall, Michael G. Pecht, Edward B. Hakim. by Lall, Pradeep Pecht, Michael G Hakim, Edward B Series: The electronic packaging series Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton, Flu : CRC Press, 1997 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.25 . L35. Place hold Add to cart (remove)
	13.	The electronic packaging handbook / edited by Glenn R. Blackwell. by Blackwell, Glenn R Series: The electrical engineers handbook series Material type: Text; Format: print Publication details: Boca Raton, Florida : CRC/IEEE Press, 2000 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . E44. Place hold Add to cart (remove)
	14.	Mechanical analysis of electronic packaging systems / Stephen A. McKeown by McKeown, Stephen A Series: Mechanical engineering Material type: Text; Format: print Publication details: New York : Marcel Dekker, 1999 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . M35. Place hold Add to cart (remove)
	15.	Electronic packaging desigm, materials, process and reliability / John H. Lau...[et al.] by Lau, John H Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: London : McGraw-Hill, 1998 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . E54. Place hold Add to cart (remove)
	16.	Electronic physical design / Barry M. Lunt. by Lunt, Barry M Material type: Text; Format: print ; Literary form: Not fiction Publication details: Upper Saddle River, NJ : Prentice Hall, 2004 Availability: Items available for loan: MAIN LIBRARY (3)Location, call number: Main Library General Collection TK7870 . L797 2004, ... Place hold Add to cart (remove)
	17.	Area array package design : techniques in high-density electronics / Ken Gilleo, ed. by Gilleo, Ken Series: McGraw-Hill engineering reference guide series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, 2004 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . A74 2004. Place hold Add to cart (remove)
	18.	No cover image available Handbook of tape automated bonding / edited by John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : Van Nostrand Reinhold, 1992 Availability: Items available for loan: MAIN LIBRARY (2)Location, call number: Main Library TK7870.15 . H37, ... Place hold Add to cart (remove)
	19.	Practical guide to the packaging of electronics : thermal and mechanical design and analysis / Ali Jamnia by Jamnia, Ali, 1961- Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Publication details: Boca Raton : CRC Press, c2009 Online resources: link to resource online. Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.15 . J36 2009. Place hold Add to cart (remove)
	20.	Heat transfer : thermal management of electronics / author, Younes Shabany by Shabany, Younes Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Publication details: Boca Raton : Taylor & Francis, 2010 Availability: Items available for loan: MAIN LIBRARY (1)Location, call number: Main Library General Collection TK7870.25 . S53 2010. Place hold Add to cart (remove)